™
High Temp
BASF Ultracur3D® RG 3280
Ceramic-filled resin with exceptionally high stiffness and temperature resistance.
• Overview
A ceramic filled photopolymer, BASF Ultracur3D® RG 3280 offers users a way to print small to medium high modulus and high heat resistance parts such as short run molds. This material is easy to clean in post processing, is highly resistant to water and has been tested against many different chemicals such as brake fluid, 10% hydrochloric acid and transmission oil. Ultracur3D® RG 3280 has been tested in steam sterilization processes and is a TPO free chemistry.
Material Properties
Values
Tensile Strength
87 MPa
Tensile Modulus
10,600 MPa
Elongation at Failure
1.3%
Impact Strength
(Notched) 24 J/m
Heat Deflection Temperature
at 0.45 MPa 284°C
Key Features
High stiffness
Great temperature, water, and chemical resistance
Material is easy to clean in post processing
· Systems
Our Systems
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
-
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
- Digital Light Processing (DLP)
- 143 x 83 x 110 mm
- Standard
- 25µm with patented pixel tuning
- 25-150µm
-
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
- Continuous Digital Light Manufacturing (CDLM)
- 180 x 101 x 175 mm and up
- LT, XL
- 60µm with patented pixel tuning
- 50-150µm
-
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
- Top-Down Digital Light Processing Array
- 450 x 371 x 399 mm
- Standard
- 100µm with patented pixel tuning
- 100-175µm
-
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
- Digital Light Processing (DLP)
- 249.1 x 140.1 x 165.1 mm
- Standard
- 65 μm
- 25, 50, 100 μm
