™
Castable
PIC 100
Non-wax material for patterns that require sharp details or delicate filigree.
• Overview
Parts made using PIC 100 resins evaporate at moderate burnout temperatures without reacting with investment. They are optimally suitable for producing precious metalcastings. PIC 100 resins build tough and easy to finish. The burnout process is ash free, allowing for a casting which is free from porosity.
Material Properties
Values
Viscosity
361.7 MPa
Density
1.178 g/cm^3
Elongation at Failure
1.3%
Ignition Temperature
350°C
Color
Amber
Key Features
Great feature resolution
Ash-free burnout process for porosity-free casting
Tough and easy to finish
· Systems
Our Systems
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
-
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
- Digital Light Processing (DLP)
- 143 x 83 x 110 mm
- Standard
- 25µm with patented pixel tuning
- 25-150µm
-
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
- Continuous Digital Light Manufacturing (CDLM)
- 180 x 101 x 175 mm and up
- LT, XL
- 60µm with patented pixel tuning
- 50-150µm
-
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
- Top-Down Digital Light Processing Array
- 450 x 371 x 399 mm
- Standard
- 100µm with patented pixel tuning
- 100-175µm
-
- Printer technology
- Build envelope
- Models
- XY Resolution
- Z Resolution
- Digital Light Processing (DLP)
- 249.1 x 140.1 x 165.1 mm
- Standard
- 65 μm
- 25, 50, 100 μm
